Electroless plating process for insulation circuit boards for power semiconductors.
The optimal electroless plating process for the base layer when joining power modules using soldering or silver sintering.
In recent years, SiC and GaN devices have garnered attention as next-generation power semiconductors (power modules) capable of high-temperature operation, with these next-generation power modules expected to operate continuously at temperatures above 200°C. Our company has developed a sulfur-free, low-phosphorus electroless nickel plating solution, "ICP Nicoron LPW-LFN," which minimizes nickel diffusion into solder even in high-temperature environments, thereby maintaining joint reliability. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace traditional solder joints. We have newly developed an electroless silver plating solution, "Top Silver ACC / Top Silver AG," which helps suppress corrosion of the base metal and contributes to improved bonding strength.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
